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Component-based workflows for parallel thermomechanical analysis of arrayed geometries

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Abstract

Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.

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Acknowledgements

The authors acknowledge the support of IBM Corporation in the performance of this research. The computing resources of the Center for Computational Innovations, at Rensselaer Polytechnic Institute, are also acknowledged. The development of tools used in this work was partly supported by U.S. Department of Energy, Office of Science, Office of Advanced Scientific Computing Research, under award DE-SC00066117 (FASTMath SciDAC Institute).

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Authors and Affiliations

  1. Scientific Computation Research Center, Rensselaer Polytechnic Institute, Troy, NY, USA

    Max O. Bloomfield, Zhen Li, Brian Granzow, Daniel A. Ibanez, Assad A. Oberai & Mark S. Shephard

  2. Sandia National Laboratory, Albuquerque, NM, USA

    Glen A. Hansen

  3. IBM TJ Watson Research Center, Yorktown Heights, NY, USA

    Xiao Hu Liu

Authors
  1. Max O. Bloomfield
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  2. Zhen Li
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  3. Brian Granzow
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  4. Daniel A. Ibanez
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  5. Assad A. Oberai
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  6. Glen A. Hansen
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  7. Xiao Hu Liu
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  8. Mark S. Shephard
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Corresponding author

Correspondence to Max O. Bloomfield.

Appendix

Appendix

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Table 1 Material properties used in model system
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Bloomfield, M.O., Li, Z., Granzow, B. et al. Component-based workflows for parallel thermomechanical analysis of arrayed geometries. Engineering with Computers 33, 509–517 (2017). https://doi.org/10.1007/s00366-016-0487-5

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  • DOI: https://doi.org/10.1007/s00366-016-0487-5

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