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How do carbon nanotubes fit into the semiconductor roadmap?

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Abstract

This paper presents an overview of the issues related to the integration of carbon nanotubes into microelectronics systems. Particular emphasis is placed on the use of carbon nanotubes as on-chip wiring (interconnects) and active devices (transistors), the two main building blocks of current semiconductor circuits. The properties of state-of-the art devices are compared in order to test the viability of replacing silicon-based components with carbon nanotubes. Further, the problems associated with the construction of nanotube-based devices are discussed.

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Authors and Affiliations

  1. Corporate Research, Infineon Technologies AG, Otto-Hahn-Ring 6, 81739, Munich, Germany

    A.P. Graham, G.S. Duesberg, W. Hoenlein, F. Kreupl, M. Liebau, R. Martin, B. Rajasekharan, W. Pamler, R. Seidel, W. Steinhoegl & E. Unger

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  1. A.P. Graham
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  2. G.S. Duesberg
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  3. W. Hoenlein
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  4. F. Kreupl
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  5. M. Liebau
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Correspondence to A.P. Graham.

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PACS

73.63.Fg; 81.07.De; 85.35.Kt; 81.16.Hc

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Graham, A., Duesberg, G., Hoenlein, W. et al. How do carbon nanotubes fit into the semiconductor roadmap?. Appl. Phys. A 80, 1141–1151 (2005). https://doi.org/10.1007/s00339-004-3151-7

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  • DOI: https://doi.org/10.1007/s00339-004-3151-7

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