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Cu2+ adsorption onto ion-imprinted composite hydrogels: thermodynamics and mechanism studies

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Abstract

In the current study, in situ free radical polymerization was employed to prepare Cu2+-imprinted composite hydrogel (Cu2+-ICH). The cross-sectional morphology of the Cu2+-ICH evaluated by scanning electron microscopy indicated that the copper-loaded Cu2+-ICH became rougher and the pore size of the gel became smaller compared to the unloaded Cu2+-ICH. The ability of the Cu2+-ICH to adsorb Cu2+ from aqueous solutions was assessed using batch adsorption technique. The adsorption capacity increased with the initial concentration of Cu2+, but decreased as the temperature rose from 298 to 318 K. Thermodynamic parameters such as Gibbs free energy (ΔG 0), enthalpy (ΔH 0), and entropy (ΔS 0) for the Cu2+ adsorption were evaluated. It was suggested that the adsorption process was a spontaneous, exothermic process that had positive entropy. Selectivity study indicated that ion imprinting technique resulted in excellent affinity of the Cu2+-ICH toward Cu2+. Finally, the adsorption mechanism was studied by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The results indicated that copper adsorption was mainly through interactions with the amine and carbonyl groups.

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Acknowledgments

The study was supported by the National Natural Science Foundation of China (Project 21407125), Science And Technology Project from the Ministry of Housing and Urban–Rural Development of the People’s Republic of China (2014-K7-007), Jiangsu Provincial Natural Science Foundation (No. BK2012251), open project from Key Laboratory for Ecological–Environment Materials of Jiangsu Province (No. EML201202), and research fund of Key Laboratory for Advanced Technology in Environmental Protection of Jiangsu Province (No. AE201069).

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  1. School of Materials Engineering, Key Laboratory for Ecological-Environment Materials of Jiangsu Province, Key Laboratory for Advanced Technology in Environmental Protection of Jiangsu Province, Yancheng Institute of Technology, Yancheng, 224051, China

    Jingjing Wang & Juan Li

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  1. Jingjing Wang
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  2. Juan Li
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Correspondence to Jingjing Wang.

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Wang, J., Li, J. Cu2+ adsorption onto ion-imprinted composite hydrogels: thermodynamics and mechanism studies. Polym. Bull. 72, 2143–2155 (2015). https://doi.org/10.1007/s00289-015-1394-4

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  • DOI: https://doi.org/10.1007/s00289-015-1394-4

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