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Modeling H, Na, and K diffusion in plagioclase feldspar by relating point defect parameters to bulk properties

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Abstract

Hydrogen and alkali ion diffusion in plagioclase feldspars is important to study the evolution of the crust and the kinetics of exsolution and ion-exchange reactions in feldspars. Using the available PVT equation of state of feldspars, we show that the diffusivities of H and alkali in plagioclase feldspars as a function of temperature can be successfully reproduced in terms of the bulk elastic and expansivity data through a thermodynamic model that interconnects point defect parameters with bulk properties. Our calculated diffusion coefficients of H, Na, and K well agree with experimental ones when uncertainties are considered. Additional point defect parameters such as activation enthalpy, activation entropy, and activation volume are also predicted. Furthermore, the electrical conductivity of feldspars inferred from our predicted diffusivities of H, Na, and K through the Nernst–Einstein equation is compared with previous experimental data.

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Acknowledgments

The authors thank two anonymous reviewers for their constructive comments. This study was supported by the 1000 Plan Program for Young Talents, Hundred Talent Program of CAS and NSF of China (41303048) to BZ, and NSF of China (41472048) to SS.

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Authors and Affiliations

  1. Key Laboratory for High-Temperature and High-Pressure Study of the Earth’s Interior, Institute of Geochemistry, Chinese Academy of Sciences, Guiyang, 550081, Guizhou, People’s Republic of China

    Baohua Zhang & Shuangming Shan

  2. School of Earth and Space Science, University of Science and Technology of China, Hefei, 230026, People’s Republic of China

    Xiaoping Wu

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  1. Baohua Zhang
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  2. Shuangming Shan
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  3. Xiaoping Wu
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Correspondence to Baohua Zhang.

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Zhang, B., Shan, S. & Wu, X. Modeling H, Na, and K diffusion in plagioclase feldspar by relating point defect parameters to bulk properties. Phys Chem Minerals 43, 151–159 (2016). https://doi.org/10.1007/s00269-015-0782-5

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  • DOI: https://doi.org/10.1007/s00269-015-0782-5

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