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Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

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Abstract

The paper presents a method for investigating heat transfer during a specific reflow soldering method, Vapour Phase Soldering (VPS), where a horizontal Printed Circuit Board (PCB) is heated in vapour medium. The paper presents refined descriptions of filmwise condensation which were investigated and adjusted for the VPS process. The results show a proper and fast approximation of measurements. The dependence of the PCB characteristic length is also investigated.

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Abbreviations

T :

Temperature, K

Q :

Thermal energy,

h :

Heat transfer coefficient, W/m2 K

A :

Body surface, m2

t :

Time, s

L :

Characteristic length, m

H :

Second lateral dimension of PCB, m

T :

Thickness of the PCB, m

A :

Surface, m2

k :

Thermal conductivity, W/m K

hlv :

Latent heat of vaporization, kJ/kg

ρ :

Density, kg/m3

α :

Inclination angle, °

g :

Gravitational constant, m/s2

μ :

Dynamic viscosity, kg/m s

Nu :

Nusselt number, dimensionless

Ra :

Rayleigh number, dimensionless

b :

Body

sat :

Saturation

FR4 :

Flame-Retardant 4, PCB type

l :

Liquid

v :

Vapour

amb :

Ambient

NL :

Nimmo–Leppert

B :

Bejan

GG :

Gerstmann–Griffith

LE :

Leider

VPS :

Vapour Phase Soldering

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Acknowledgments

This paper was supported by the János Bolyai Research Scholarship of the Hungarian Academy of Sciences.

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Authors and Affiliations

  1. Department of Electronics Technology, Budapest University of Technology and Economics, Egry J. u. 18., V1 Building, V1-013, Budapest, 1111, Hungary

    Attila Géczy, Balázs Illés, Zsolt Péter & Zsolt Illyefalvi-Vitéz

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  1. Attila Géczy
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  2. Balázs Illés
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  3. Zsolt Péter
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  4. Zsolt Illyefalvi-Vitéz
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Correspondence to Attila Géczy.

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Géczy, A., Illés, B., Péter, Z. et al. Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards. Heat Mass Transfer 51, 335–342 (2015). https://doi.org/10.1007/s00231-014-1386-1

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