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XPS depth profile of plasma-activated surface of beech wood (Fagus sylvatica) and its impact on polyvinyl acetate tensile shear bond strength

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Abstract

High surface selectivity of atmospheric pressure plasma treatment was demonstrated experimentally by XPS depth profile measurement of plasma-activated beech wood. Wood surface activated by diffuse coplanar surface barrier discharge was sequentially sputtered by Ar+ ion beam followed by immediate XPS analysis of freshly uncovered surface. According to the assessment, less than 330 nm of sputtered material was sufficient for complete removal of all plasma-formed functional groups. For the sake of practical implications of minimal vertical extent of plasma-mediated changes, the character of tensile shear bond strength improvement of polyvinyl acetate adhesive was examined with respect to its specific mass. A constant additive character of plasma activation to the bond strength was observed within the examined range of adhesive-specific mass.

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Acknowledgments

This research was supported in part by the Project ‘R&D Centre for Low-Cost Plasma and Nanotechnology Surface Modifications’—CZ.1.05/2.1.00/03.0086 funded by European Development Fund, the European Social Fund and the state budget of the Czech Republic, Project ‘The Establishment of an International Research Team for the Development of New Wood-based Materials’ Reg. No. CZ.1.07/2.3.00/20.0269 and Internal Grant Agency (IGA) of the Faculty of Forestry and Wood Technology, Mendel University in Brno (IGA-79/2013) as well as by the Program of ‘Employment of Newly Graduated Doctors of Science for Scientific Excellence’ (Grant number CZ.1.07/2.3.00/30.009) co-financed from European Social Fund and the state budget of the Czech Republic.

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Correspondence to Jozef Ráhel’.

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Král, P., Ráhel’, J., Stupavská, M. et al. XPS depth profile of plasma-activated surface of beech wood (Fagus sylvatica) and its impact on polyvinyl acetate tensile shear bond strength. Wood Sci Technol 49, 319–330 (2015). https://doi.org/10.1007/s00226-014-0691-7

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  • DOI: https://doi.org/10.1007/s00226-014-0691-7

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