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Phase and stress evolution of Si swarf in the diamond-coated wire sawing of Si ingots

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Abstract

Diamond-coated wire (DCW) sawing of Si solar ingots generates swarf which is analyzed using micro-Raman spectroscopy. Two types of Si swarf are found. Particulate swarf is crystalline and shows residual compressive stress. Fibrillar swarf is amorphous and shows residual tensile stress. The origin of particulate, crystalline swarf is attributed to brittle machining, while the origin of fibrillar, amorphous swarf is attributed to ductile machining. Finite element modeling suggests that brittle machining resulting in particulate, crystalline swarf generation is initiated by sharp diamond microparticles. On the other hand, ductile machining resulting in fibrillar, amorphous swarf generation is caused by blunt diamond microparticles. Over the course of sawing, the ratio of crystalline/amorphous phase in swarf decreases, quantifying the average loss in sharpness of diamond microparticles. Thus, micro-Raman spectroscopy can be an effective analytical tool for quantifying and monitoring DCW sawing processes for Si solar ingots.

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Authors and Affiliations

  1. Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, One Brookings Drive, St. Louis, MO, 63130, USA

    Sriya Banerjee, Junting Yang, Junnan Wu, Yoon Myung & Parag Banerjee

  2. Institute of Materials Science and Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, MO, 63130, USA

    Zhengning Gao & Parag Banerjee

  3. Energy, Environmental and Chemical Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, MO, 63130, USA

    Michelle Heredia

  4. SunEdison, 501 Pearl Drive, St. Peters, MO, 63376, USA

    Junnan Wu & Omid Rezvanian

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  1. Sriya Banerjee
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  2. Junting Yang
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  3. Junnan Wu
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  4. Michelle Heredia
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  5. Zhengning Gao
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  7. Omid Rezvanian
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  8. Parag Banerjee
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Correspondence to Parag Banerjee.

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Banerjee, S., Yang, J., Wu, J. et al. Phase and stress evolution of Si swarf in the diamond-coated wire sawing of Si ingots. Int J Adv Manuf Technol 89, 735–742 (2017). https://doi.org/10.1007/s00170-016-9102-6

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  • DOI: https://doi.org/10.1007/s00170-016-9102-6

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