, Volume 61, Issue 6, pp 28–28

Lead-free soldering: Materials science and solder joint reliability

  • Kejun Zeng
Lead-Free Solder Commentary

DOI: 10.1007/s11837-009-0084-9

Cite this article as:
Zeng, K. JOM (2009) 61: 28. doi:10.1007/s11837-009-0084-9
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© TMS 2009

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  • Kejun Zeng

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