The bonding of nanowire assemblies using adhesive and solder
- Cite this article as:
- Gu, Z., Ye, H., Gracias, D.H. et al. JOM (2005) 57: 60. doi:10.1007/s11837-005-0185-z
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In the past decade, several strategies have been proposed to direct the assembly of nanocomponents from the bottom up to fabricate two- and three-dimensional integrated structures. In these strategies, either the surface or the bulk of a nanocomponent is functionalized to facilitate positive and negative interactions based on molecular, electrostatic, magnetic, or capillary forces, to enable the components to interact with one another in a fluidic medium and form thermodynamically stable structures. However, in many cases, the assembled structures are not well bonded. This paper summarizes results on directing the assembly of metallic rod-shaped (30–200 nm diameter) components with one another and with substrates to form structures that can be bonded by adhesive or solder. The methodology can be adapted with other self-assembling strategies to form mechanically stable, and in certain instances electrically conductive, assemblies composed of nanoscale componenents.