JOM

, Volume 57, Issue 12, pp 60–64

The bonding of nanowire assemblies using adhesive and solder

  • Zhiyong Gu
  • Hongke Ye
  • David H. Gracias
  • David Gracias
Research Summary Surface Engineering

DOI: 10.1007/s11837-005-0185-z

Cite this article as:
Gu, Z., Ye, H., Gracias, D.H. et al. JOM (2005) 57: 60. doi:10.1007/s11837-005-0185-z

Abstract

In the past decade, several strategies have been proposed to direct the assembly of nanocomponents from the bottom up to fabricate two- and three-dimensional integrated structures. In these strategies, either the surface or the bulk of a nanocomponent is functionalized to facilitate positive and negative interactions based on molecular, electrostatic, magnetic, or capillary forces, to enable the components to interact with one another in a fluidic medium and form thermodynamically stable structures. However, in many cases, the assembled structures are not well bonded. This paper summarizes results on directing the assembly of metallic rod-shaped (30–200 nm diameter) components with one another and with substrates to form structures that can be bonded by adhesive or solder. The methodology can be adapted with other self-assembling strategies to form mechanically stable, and in certain instances electrically conductive, assemblies composed of nanoscale componenents.

Copyright information

© Minerals, Metals & Materials Society 2005

Authors and Affiliations

  • Zhiyong Gu
    • 1
  • Hongke Ye
    • 1
  • David H. Gracias
    • 1
  • David Gracias
    • 2
  1. 1.the Department of Chemical and Biomolecular Engineering at Johns Hopkins UniversityBaltimore
  2. 2.the Department of Chemistry at Johns Hopkins UniversityUSA