, Volume 57, Issue 6, pp 44–49

The orientation imaging microscopy of lead-free Sn-Ag solder joints

  • A. U. Telang
  • T. R. Bieler
Research Summary Lead-Free Solder

DOI: 10.1007/s11837-005-0135-9

Cite this article as:
Telang, A.U. & Bieler, T.R. JOM (2005) 57: 44. doi:10.1007/s11837-005-0135-9


Orientation imaging microscopy was used to identify solidification microstructures and early stages of damage evolution in tin-silver eutectic solder joints on copper and nickel substrates after aging, creep, and thermomechanical fatigue. A visco-plastic self-consistent plasticity model was able to simulate texture changes when work hardening occurred at higher strain rates, but not with lower rates, where grain boundary sliding dominated the deformation and slip occurred predominantly on one or two slip systems that could be predicted using a Schmid (Sachs) analysis.

Copyright information

© TMS 2005

Authors and Affiliations

  • A. U. Telang
    • 1
  • T. R. Bieler
    • 2
  1. 1.Department of Chemical Engineering and Materials ScienceMichigan State UniversityEast Lansing
  2. 2.Michigan State UniversityEast Lansing

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