JOM

, Volume 53, Issue 6, pp 22–26

Creep properties of Sn-Ag solder joints containing intermetallic particles

  • S. Choi
  • J. G. Lee
  • F. Guo
  • T. R. Bieler
  • K. N. Subramanian
  • J. P. Lucas
Research Summary Lead-Free Solder

DOI: 10.1007/s11837-001-0098-4

Cite this article as:
Choi, S., Lee, J.G., Guo, F. et al. JOM (2001) 53: 22. doi:10.1007/s11837-001-0098-4

Abstract

The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4, and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85°C, and 125°C. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stressexponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed to occur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.

Copyright information

© TMS 2001

Authors and Affiliations

  • S. Choi
    • 1
  • J. G. Lee
    • 1
  • F. Guo
    • 1
  • T. R. Bieler
    • 1
  • K. N. Subramanian
    • 1
  • J. P. Lucas
    • 1
  1. 1.the Department of Materials Science & MechanicsMichigan State UniversityUSA