Nano Express

Nanoscale Research Letters

, Volume 4, Issue 12, pp 1481-1485

Open Access This content is freely available online to anyone, anywhere at any time.

Architectural Growth of Cu Nanoparticles Through Electrodeposition

  • Wen-Yin KoAffiliated withDepartment of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University
  • , Wei-Hung ChenAffiliated withDepartment of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University
  • , Ching-Yuan ChengAffiliated withExperimental Facility Division, National Synchrotron Research Center
  • , Kaun-Jiuh LinAffiliated withDepartment of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University Email author 

Abstract

Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nanoparticles was observed for the first time. We believe that our method might open new possibilities for fabricating nanomaterials of non-noble transition metals with various novel architectures, which can then potentially be utilized in applications such as biosensors, catalysis, photovoltaic cells, and electronic nanodevices.

Keywords

Copper Shape control Electrochemistry Nanostructure Nanoparticles