Journal of Electronic Materials

, Volume 34, Issue 2, pp 168–175

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Authors

  • Kyoung-Sik Moon
    • School of Materials Science and EngineeringGeorgia Institute of Technology
  • Hai Dong
    • School of Materials Science and EngineeringGeorgia Institute of Technology
  • Radenka Maric
    • nGimat Corporation
  • Suresh Pothukuchi
    • School of Materials Science and EngineeringGeorgia Institute of Technology
  • Andrew Hunt
    • nGimat Corporation
  • Yi Li
    • School of Materials Science and EngineeringGeorgia Institute of Technology
  • C. P. Wong
    • School of Materials Science and EngineeringGeorgia Institute of Technology
Regular Issue Paper

DOI: 10.1007/s11664-005-0229-8

Cite this article as:
Moon, K., Dong, H., Maric, R. et al. Journal of Elec Materi (2005) 34: 168. doi:10.1007/s11664-005-0229-8

Abstract

Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag particles used (∼20 nm) exhibited obvious sintering behavior at significantly lower temperatures (∼150°C) than the Tm (960°C) of silver. Coalescence of the nano Ag particles was observed by sintering the particles at 150°C, 200°C, and 250°C. The thermal profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the sintering process was observed by thermomechanical analysis (TMA). Sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity. The size of the sintered particles and the crystallite size of the particles increased with increasing sintering temperature.

Key words

Silver nanoparticlesthermal behaviorsinteringmelting point depressionlow-temperature interconnect
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Copyright information

© TMS-The Minerals, Metals and Materials Society 2005