Regular Issue Paper

Journal of Electronic Materials

, Volume 34, Issue 2, pp 168-175

First online:

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

  • Kyoung-Sik MoonAffiliated withSchool of Materials Science and Engineering, Georgia Institute of Technology
  • , Hai DongAffiliated withSchool of Materials Science and Engineering, Georgia Institute of Technology
  • , Radenka MaricAffiliated withnGimat Corporation
  • , Suresh PothukuchiAffiliated withSchool of Materials Science and Engineering, Georgia Institute of Technology
  • , Andrew HuntAffiliated withnGimat Corporation
  • , Yi LiAffiliated withSchool of Materials Science and Engineering, Georgia Institute of Technology
  • , C. P. WongAffiliated withSchool of Materials Science and Engineering, Georgia Institute of Technology

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Abstract

Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag particles used (∼20 nm) exhibited obvious sintering behavior at significantly lower temperatures (∼150°C) than the Tm (960°C) of silver. Coalescence of the nano Ag particles was observed by sintering the particles at 150°C, 200°C, and 250°C. The thermal profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the sintering process was observed by thermomechanical analysis (TMA). Sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity. The size of the sintered particles and the crystallite size of the particles increased with increasing sintering temperature.

Key words

Silver nanoparticles thermal behavior sintering melting point depression low-temperature interconnect