Metallurgical and Materials Transactions A

, Volume 43, Issue 10, pp 3742–3747

Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte

  • Mui Chee Liew
  • Ibrahym Ahmad
  • Liu Mei Lee
  • Muhammad Firdaus Mohd Nazeri
  • Habsah Haliman
  • Ahmad Azmin Mohamad
Article

DOI: 10.1007/s11661-012-1194-5

Cite this article as:
Liew, M.C., Ahmad, I., Lee, L.M. et al. Metall and Mat Trans A (2012) 43: 3742. doi:10.1007/s11661-012-1194-5

Abstract

The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (Ecorr) and corrosion current density (icorr) obtained from the sample was –1.108 V vs Hg/HgO and 1.795 × 10−4 A cm−2, respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures.

Copyright information

© The Minerals, Metals & Materials Society and ASM International 2012

Authors and Affiliations

  • Mui Chee Liew
    • 1
  • Ibrahym Ahmad
    • 1
  • Liu Mei Lee
    • 1
  • Muhammad Firdaus Mohd Nazeri
    • 1
  • Habsah Haliman
    • 1
  • Ahmad Azmin Mohamad
    • 1
  1. 1.School of Materials and Mineral Resources Engineering, Universiti Sains MalaysiaPenangMalaysia

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