Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte
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- Liew, M.C., Ahmad, I., Lee, L.M. et al. Metall and Mat Trans A (2012) 43: 3742. doi:10.1007/s11661-012-1194-5
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The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (Ecorr) and corrosion current density (icorr) obtained from the sample was –1.108 V vs Hg/HgO and 1.795 × 10−4 A cm−2, respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures.