Metallurgical and Materials Transactions A

, Volume 36, Issue 1, pp 99–105

Creep deformation characteristics of tin and tin-based electronic solder alloys

  • M. D. Mathew
  • H. Yang
  • S. Movva
  • K. L. Murty

DOI: 10.1007/s11661-005-0142-z

Cite this article as:
Mathew, M.D., Yang, H., Movva, S. et al. Metall and Mat Trans A (2005) 36: 99. doi:10.1007/s11661-005-0142-z


Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Qc=60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Qc values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.

Copyright information

© ASM International & TMS-The Minerals, Metals and Materials Society 2005

Authors and Affiliations

  • M. D. Mathew
    • 1
  • H. Yang
    • 2
  • S. Movva
    • 3
  • K. L. Murty
    • 4
  1. 1.the Indira Gandhi Center for Atomic ResearchKalpakkamIndia
  2. 2.AMCCSan Diego
  3. 3.Qualcomm CDMA TechnologiesSan Diego
  4. 4.North Carolina State UniversityRaleigh