Metallurgical and Materials Transactions A

, Volume 36, Issue 1, pp 99-105

First online:

Creep deformation characteristics of tin and tin-based electronic solder alloys

  • M. D. MathewAffiliated withthe Indira Gandhi Center for Atomic Research
  • , H. YangAffiliated withAMCC
  • , S. MovvaAffiliated withQualcomm CDMA Technologies
  • , K. L. MurtyAffiliated withNorth Carolina State University

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Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Q c =60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q c values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.