Experimental Mechanics

, Volume 48, Issue 5, pp 665–673

Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution


DOI: 10.1007/s11340-008-9127-3

Cite this article as:
Chen, B. & Basaran, C. Exp Mech (2008) 48: 665. doi:10.1007/s11340-008-9127-3


Moiré Interferometry (MI) theoretically can provide real-time full strain field measurements in dynamic environment. So it’s extensively used in reliability analysis of electronic packaging. Due to the nature of specimen preparations procedure, the optical noise is usually too strong so that an accurate phase-based information processing is not possible. In this paper, a 164 nm/pixel spatial resolution Moiré Interferometer with automated full strain field calculation is proposed. Provided by two-level zooming system, the high spatial resolution increase the signal intensity and eliminate some optical noise which allows accurate full strain field map generated automatically by the combination of phase shifting technique and continuous wavelet transform (CWT). Furthermore, the calculation procedure of CWT proposed here does not require unwrapping and differentiation, which avoid the possible numerical noise introduced in these two steps. In the proposed system, pixel by pixel in-plane strain tensors will be calculate from the intensity map of interferograms using phase-based method. The resulting strain tensor can be used to model constitutive relationship or compare with finite element analysis results. A thermal experiment on BGA packaging is used to demonstrate the advantages of the proposed new design.


Automatic Moiré interferometry Electronic packaging Solder joint reliability Phase shifting Continuous wavelet transform 

Copyright information

© Society for Experimental Mechanics 2008

Authors and Affiliations

  1. 1.Electronic Packaging LaboratoryState University of New York at BuffaloBuffaloUSA