Research on Chemical Intermediates

, Volume 40, Issue 1, pp 33–40

Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites

Article

DOI: 10.1007/s11164-013-1452-1

Cite this article as:
Yu, S., Kim, DK., Park, C. et al. Res Chem Intermed (2014) 40: 33. doi:10.1007/s11164-013-1452-1

Abstract

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC–Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN–Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K .

Keywords

Thermal conductivityNylon 6,6Silicon carbideBoron nitrideComposites

Copyright information

© Springer Science+Business Media Dordrecht 2013

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringYonsei UniversitySeoulKorea
  2. 2.Center for Materials Architecturing, Institute for Multi-Disciplinary Convergence of MaterialsKorea Institute of Science and Technology (KIST)SeoulKorea
  3. 3.Nanomaterials Science and EngineeringUniversity of Science and TechnologyDaejeonKorea