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Comparative Analysis of Thermal Deformations in Structural Elements of Measurement Stands and Supports

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Measurement Techniques Aims and scope

Thermal deformations in structural elements of a stand and measurement support are estimated and values for the thermal deformation coefficient are determined. Recommendations are made regarding the use of stands and supports for nanometer-range measurements.

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References

  1. O. S. Bashevskaya, S. V. Bushuev, Yu. V. Poduraev, et al., “An investigation of the influence of temperature deformations on the precision of linear measurements,” Izmer. Tekhn., No. 9, 34–36 (2013).

  2. GOST 10197–70, Stands and Supports for Measurement Heads. Specifications.

  3. RD 50-98–86, Procedural Guidelines. Choice of Universal Measurement Equipment for Linear Measurements of up to 500 mm.

  4. O. S. Bashevskaya, S. V. Bushuev, Yu. V. Poduraev, et al., “Development of an experimental-analytical method for determining temperature deformations of end measures for length in the nanometer range,” Izmer. Tekhn., No. 3, 8–11 (2014).

  5. GOST 8.050–73, GSI. Standard Conditions for Linear and Angular Measurements.

  6. GOST 8.051–81, GSI. Permissible Errors for Linear Measurements of up to 500 mm.

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Authors and Affiliations

  1. STANKIN Moscow State Technological University, Moscow, Russia

    O. S. Bashevskaya, S. V. Bushuev, Yu. V. Ilyukhin, E. A. Mel’nichenko, E. V. Romash & Yu. V. Poduraev

  2. Research and Design Institute of Measuring Means in Mechanical Engineering (NIIizmereniya), Moscow, Russia

    M. G. Kovalskiy

Authors
  1. O. S. Bashevskaya
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  2. S. V. Bushuev
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  3. Yu. V. Ilyukhin
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  4. M. G. Kovalskiy
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  5. E. A. Mel’nichenko
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  6. E. V. Romash
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  7. Yu. V. Poduraev
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Corresponding author

Correspondence to O. S. Bashevskaya.

Additional information

Translated from Izmeritel’naya Tekhnika, No. 7, pp. 24–27, July, 2015.

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Bashevskaya, O.S., Bushuev, S.V., Ilyukhin, Y.V. et al. Comparative Analysis of Thermal Deformations in Structural Elements of Measurement Stands and Supports. Meas Tech 58, 760–765 (2015). https://doi.org/10.1007/s11018-015-0790-3

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  • DOI: https://doi.org/10.1007/s11018-015-0790-3

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