Journal of Materials Science: Materials in Electronics

, Volume 22, Issue 6, pp 631–638

Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys

  • Yu. Plevachuk
  • V. Sklyarchuk
  • A. Yakymovych
  • P. Svec
  • D. Janickovic
  • E. Illekova
Article

DOI: 10.1007/s10854-010-0188-6

Cite this article as:
Plevachuk, Y., Sklyarchuk, V., Yakymovych, A. et al. J Mater Sci: Mater Electron (2011) 22: 631. doi:10.1007/s10854-010-0188-6

Abstract

Tin-antimony-copper alloys are under intense consideration as favourable lead-free solders for consumer electronics and telecommunications. The electrical conductivity and viscosity studies were carried out in a wide temperature range above the liquidus. A melting-solidification region was investigated by Differential Scanning Calorimetry (DSC). The scaling relations have been proposed. A comparison with data available in literature is given.

Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Yu. Plevachuk
    • 1
  • V. Sklyarchuk
    • 1
  • A. Yakymovych
    • 1
  • P. Svec
    • 2
  • D. Janickovic
    • 2
  • E. Illekova
    • 2
  1. 1.Department of Metal PhysicsIvan Franko National UniversityLvivUkraine
  2. 2.Slovak Academy of SciencesInstitute of PhysicsBratislavaSlovakia