Microfluidics and Nanofluidics

, Volume 3, Issue 1, pp 119–122

Bonding of soda-lime glass microchips at low temperature

Short Communication

DOI: 10.1007/s10404-006-0101-z

Cite this article as:
Iles, A., Oki, A. & Pamme, N. Microfluid Nanofluid (2007) 3: 119. doi:10.1007/s10404-006-0101-z

Abstract

A simple, low-temperature bonding process is described for the fabrication of soda-lime glass microfluidic chips. Due to its chemical inertness and temperature stability, glass remains a popular material for microfluidic chips despite the advances that have been made with polymer materials. Conventional thermal bonding is performed over the course of 24 h at 600°C and requires a precise temperature-controlled furnace. Here we introduce a simple low-temperature alternative for the high-strength bonding of soda-lime glass wafers based on the use of diluted HF solution in combination with pressure at a temperature of 65°C.

Keywords

Soda-lime glass microchips Pressure-assisted bonding Microchip fabrication 

Copyright information

© Springer-Verlag 2006

Authors and Affiliations

  1. 1.International Centre for Young Scientists (ICYS)National Institute for Materials Science (NIMS)IbarakiJapan
  2. 2.Horiike-GroupNIMSIbarakiJapan
  3. 3.Department of ChemistryUniversity of HullHullUK

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