, Volume 8, Issue 3, pp 187-189
Date: 03 Sep 2003

Giant magnetoresistance in electrodeposited Ni-Cu/Cu multilayers and anisotropic magnetoresistance in pulse-plated Ni x Cu1−x alloy films

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Ni-Cu/Cu multilayers and Ni x Cu1−x alloy films were electrodeposited on Au-coated glass substrates from a sulfamate-based electrolyte. The room-temperature magnetoresistance of the multilayers was studied as a function of the ferromagnetic Ni-Cu layer thickness. Giant magnetoresistance was observed, which peaked at about 1% for a Ni-Cu layer thickness around 15 Å. Magnetoresistance measurements of Ni x Cu1−x films of different composition were obtained at both room temperature and 77 K. Anisotropic magnetoresistance of up to 1.1% and 1.7% was observed at room temperature and 77 K, respectively.

Presented at the 3rd International Symposium on Electrochemical Processing of Tailored Materials held at the 53rd Annual Meeting of the International Society of Electrochemistry, 15–20 September 2002, Düsseldorf, Germany