Microsystem Technologies

, 15:1835

Miniaturization limits of piezoresistive MEMS accelerometers

  • Manuel Engesser
  • Axel R. Franke
  • Matthias Maute
  • Daniel C. Meisel
  • Jan G. Korvink
Technical Paper

DOI: 10.1007/s00542-009-0920-4

Cite this article as:
Engesser, M., Franke, A.R., Maute, M. et al. Microsyst Technol (2009) 15: 1835. doi:10.1007/s00542-009-0920-4

Abstract

We present the miniaturization limits of axially loaded piezoresistive MEMS accelerometers. Therefore we identify limiting factors on the basis of FEM-verified analytical models. To ensure a broad discussion we compare two different axially loaded topologies: first a conventional topology, which can be manufactured already today, and second a future-oriented topology utilizing nanowires. To enable a realistic comparison of the different topologies we shrink the sensor while maintaining a specific performance (e.g. sensitivity and noise) considering design limitations such as fracture of silicon and buckling. To find the minimum total sensor area under certain constraints and therefore the optimal geometric and material parameters we apply optimization techniques to our analytical models. It will be seen that the piezoresistive transducer principle for MEMS accelerometers has a promising shrink potential with minimum total sensor dimensions as low as 150 × 150 × 10 μm3 achievable by use of currently available manufacturing processes.

Copyright information

© Springer-Verlag 2009

Authors and Affiliations

  • Manuel Engesser
    • 1
  • Axel R. Franke
    • 1
  • Matthias Maute
    • 1
  • Daniel C. Meisel
    • 1
  • Jan G. Korvink
    • 2
  1. 1.Robert Bosch GmbHGerlingenGermany
  2. 2.Department of Microsystems Engineering (IMTEK) and Freiburg Institute of Advanced Studies (FRIAS)University of FreiburgFreiburgGermany