Microsystem Technologies

, Volume 15, Issue 7, pp 1045–1049

Femtosecond laser-induced silicon surface morphology in water confinement

  • Yukun Han
  • Cheng-Hsiang Lin
  • Hai Xiao
  • Hai-Lung Tsai
Technical Paper

DOI: 10.1007/s00542-009-0880-8

Cite this article as:
Han, Y., Lin, CH., Xiao, H. et al. Microsyst Technol (2009) 15: 1045. doi:10.1007/s00542-009-0880-8

Abstract

This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micromachining surface quality in industrial applications.

Copyright information

© Springer-Verlag 2009

Authors and Affiliations

  • Yukun Han
    • 1
  • Cheng-Hsiang Lin
    • 1
  • Hai Xiao
    • 2
  • Hai-Lung Tsai
    • 1
  1. 1.Department of Mechanical and Aerospace EngineeringMissouri University of Science and TechnologyRollaUSA
  2. 2.Department of Electrical and Computer EngineeringMissouri University of Science and TechnologyRollaUSA

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