Microsystem Technologies

, Volume 13, Issue 11, pp 1483–1487

High quality factor copper inductors integrated in deep dry-etched quartz substrates

  • C. Leroy
  • M. B. Pisani
  • C. Hibert
  • D. Bouvet
  • M. Puech
  • A. M. Ionescu
Technical Paper

DOI: 10.1007/s00542-006-0364-z

Cite this article as:
Leroy, C., Pisani, M.B., Hibert, C. et al. Microsyst Technol (2007) 13: 1483. doi:10.1007/s00542-006-0364-z

Abstract

This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and high self-resonance frequency (SRF) devices using quartz insulating substrates and thick high-conductivity copper lines. Inductors are key devices in RF circuits that, when fabricated on traditional semiconductor substrates, suffer from poor RF performances due to thin metallization and substrate related losses. Many previous works revealed that RF performances are strongly dependent on the limited metallization thickness and on the conductivity of the substrate. In this paper we demonstrate a new fabrication process to improve the Q factor of spiral inductors by patterning thick high conductive metal layers directly in a dielectric substrate. Moreover, we develop and validate accurate equivalent circuit modeling and parameter extraction for the characterization of the fabricated devices.

Copyright information

© Springer-Verlag 2007

Authors and Affiliations

  • C. Leroy
    • 1
  • M. B. Pisani
    • 1
    • 2
  • C. Hibert
    • 2
  • D. Bouvet
    • 1
  • M. Puech
    • 3
  • A. M. Ionescu
    • 1
  1. 1.Electronics Laboratory (LEG)Institute of Microelectronics and Microsystems (IMM), Ecole Polytechnique Federale de Lausanne (EPFL)LausanneSwitzerland
  2. 2.Center of Micro and Nanotechnology (CMI)Institute of Microelectronics and Microsystems (IMM), Ecole Polytechnique Federale de Lausanne (EPFL)LausanneSwitzerland
  3. 3.Alcatel Vacuum TechnologyAnnecyFrance