Microsystem Technologies

, Volume 9, Issue 6, pp 395–398

Development of a freestanding copper antiscatter grid using deep X-ray lithography

  • O. V. Makarova
  • C.-M. Tang
  • D. C. Mancini
  • N. Moldovan
  • R. Divan
  • D. G. Ryding
  • R. H. Lee
Article

DOI: 10.1007/s00542-002-0256-9

Cite this article as:
Makarova, O., Tang, CM., Mancini, D. et al. Microsystem Technologies (2003) 9: 395. doi:10.1007/s00542-002-0256-9

Abstract

A prototype freestanding copper antiscatter grid with parallel lamellar walls has been fabricated using deep X-ray lithography and electroforming. The freestanding copper grid has square shaped lamellar walls that are 25 μm thick and 1 mm tall with a 550 μm period. For mammography applications, the lamellar walls have to be aligned to a point X-ray source of the X-ray system. To achieve this goal, we investigated a dynamic double-exposure technique. Our progress in using stacked exposures and use of the photoresist SU-8, both to reduce fabrication cost, is also presented.

Copyright information

© Springer-Verlag Berlin Heidelberg 2003

Authors and Affiliations

  • O. V. Makarova
    • 1
  • C.-M. Tang
    • 1
  • D. C. Mancini
    • 2
  • N. Moldovan
    • 2
  • R. Divan
    • 2
  • D. G. Ryding
    • 2
  • R. H. Lee
    • 2
  1. 1.Creatv MicroTechInc. PotomacUSA
  2. 2.Advanced Photon SourceArgonne National LaboratoryArgonneUSA

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