Development of a freestanding copper antiscatter grid using deep X-ray lithography
- Cite this article as:
- Makarova, O., Tang, CM., Mancini, D. et al. Microsystem Technologies (2003) 9: 395. doi:10.1007/s00542-002-0256-9
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A prototype freestanding copper antiscatter grid with parallel lamellar walls has been fabricated using deep X-ray lithography and electroforming. The freestanding copper grid has square shaped lamellar walls that are 25 μm thick and 1 mm tall with a 550 μm period. For mammography applications, the lamellar walls have to be aligned to a point X-ray source of the X-ray system. To achieve this goal, we investigated a dynamic double-exposure technique. Our progress in using stacked exposures and use of the photoresist SU-8, both to reduce fabrication cost, is also presented.