Microsystem Technologies

, Volume 8, Issue 2, pp 93–98

Moving mask deep X-ray lithography system with multi stage for 3-D microfabrication

  • O. Tabata
  • H. You
  • N. Matsuzuka
  • T. Yamaji
  • S. Uemura
  • I. Dama

DOI: 10.1007/s00542-001-0168-0

Cite this article as:
Tabata, O., You, H., Matsuzuka, N. et al. Microsystem Technologies (2002) 8: 93. doi:10.1007/s00542-001-0168-0

Abstract

 Based on a moving mask deep X-ray lithography concept, a new deep X-ray exposure system with multi stage has been built up, which can fabricate 3 dimensional microstructures with controllable free shaped wall such as inclined, curved and vertical wall. The system has 6 stages, an X-stage and a Y-stage for substrate scanning, a substrate tilt stage and a substrate rotation stage for controlling an incident X-ray angle to a substrate, an X–Y stage for mask movement and X–Y stage for substrate and mask alignment. The system performance has been confirmed by fabricating microstructures such as gratings, micro grid and micro prism.

Copyright information

© Springer-Verlag Berlin Heidelberg 2002

Authors and Affiliations

  • O. Tabata
    • 1
  • H. You
    • 1
  • N. Matsuzuka
    • 1
  • T. Yamaji
    • 1
  • S. Uemura
    • 1
  • I. Dama
    • 1
  1. 1.Faculty of Science and Engineering, Ritsumeikan University, 1-1-1 Noji-higashi, Kusatsu-shi, Shiga 525-8577, Japan E-mail: tabata@se.ritsumei.ac.jpJP