Recent developments in dimensional metrology for microsystem components
- Cite this article as:
- Cao, S., Brand, U., Kleine-Besten, T. et al. Microsystem Technologies (2002) 8: 3. doi:10.1007/s00542-001-0156-4
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The PTB currently develops a special coordinate measuring machine (μCMM) for three-dimensional metrology on microsystem components. This μCMM is aimed at a measurement uncertainty of 3D-coordinates of <0.1 μm for microstructures. The instrument contains an opto-tactile sensor and a new tactile 3D-micro-sensing system. The 3D-micro probe is based on a silicon boss-membrane with piezo resistive transducers which allow measuring deflections of the probe pin and simultaneously forces in three dimensions. First 2D-probing experiments with a stiff commercial stylus, 15 mm long, with a 300 μm ruby ball have been carried out showing its resolution and repeatability.