, Volume 111, Issue 4, pp 1051-1056

Direct top–down fabrication of nanoscale electrodes for organic semiconductors using fluoropolymer resists

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Abstract

We report the use of a fluoropolymer resist for the damage-free e-beam lithographic patterning of organic semiconductors. The same material is also shown to be suitable as an orthogonal electron beam resist for the patterning of top-contact electrodes on organic thin films. We demonstrate this by characterizing pentacene field-effect transistors with feature sizes as small as 100 nm and compare the performance of bottom- and top-contacted devices.

J. Park and J. Ho contributed equally to this work.