Abstract
We report on the fabrication of high performance InP-based devices on an exact (001)Si-substrate. On an InP-on-Si quasi-substrate, the growth of superlattices and low-temperature InAlAs buffer for surface and device layer improvement is investigated. The selected device examples are an InGaAsP PIN diode and an (In)AlAs/In(Ga)As resonant tunnelling diodes. The functionality of these examples relies sensitively on sharp interfaces of ultra thin layers and a high optical quality of epitaxially grown III/V layers silicon substrates. A qualitative improvement is obtained for a low-temperature InAlAs buffer layer grown prior to the of device layers. Based on device models extracted from the fabricated devices a potentially low-cost optical receiver circuit on a Si-substrate is proposed and simulated using HSPICE up to 10 Gbit/s.
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73.40.Kp; 73.43.Jn; 73.61.Ey; 78.70.Ck; 78.70.Gq
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Prost, W., Khorenko, V., Mofor, AC. et al. High performance III/V RTD and PIN diode on a silicon (001) substrate. Appl. Phys. A 87, 539–544 (2007). https://doi.org/10.1007/s00339-007-3920-1
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DOI: https://doi.org/10.1007/s00339-007-3920-1