Contact improvement of carbon nanotubes via electroless nickel deposition
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- Liebau, M., Unger, E., Duesberg, G. et al. Appl Phys A (2003) 77: 731. doi:10.1007/s00339-003-2207-4
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Individual multi-walled carbon nanotubes (CNTs) were deposited onto microelectrodes and embedded in nickel to achieve low-ohmic contact resistances. Electroless deposition of nickel onto gold/iron, palladium, and cobalt microelectrodes was used to form electrically stable bonds at the interfaces between the electrodes and CNTs. Resistance measurements showed that the contact resistances of the CNTs on gold/iron and palladium were significantly improved by nickel embedding, whereas no further improvement was found for the CNTs on cobalt. Electroless metal deposition is a parallel process providing stable electrical and mechanical contacts between CNTs and metallic microelectrodes.