Applied Physics A

, Volume 77, Issue 6, pp 731–734

Contact improvement of carbon nanotubes via electroless nickel deposition

Authors

    • CPR Nano ProcessesInfineon Technologies AG
  • E. Unger
    • CPR Nano ProcessesInfineon Technologies AG
  • G.S. Duesberg
    • CPR Nano ProcessesInfineon Technologies AG
  • A.P. Graham
    • CPR Nano ProcessesInfineon Technologies AG
  • R. Seidel
    • CPR Nano ProcessesInfineon Technologies AG
  • F. Kreupl
    • CPR Nano ProcessesInfineon Technologies AG
  • W. Hoenlein
    • CPR Nano ProcessesInfineon Technologies AG
Rapid communication

DOI: 10.1007/s00339-003-2207-4

Cite this article as:
Liebau, M., Unger, E., Duesberg, G. et al. Appl Phys A (2003) 77: 731. doi:10.1007/s00339-003-2207-4

Abstract

Individual multi-walled carbon nanotubes (CNTs) were deposited onto microelectrodes and embedded in nickel to achieve low-ohmic contact resistances. Electroless deposition of nickel onto gold/iron, palladium, and cobalt microelectrodes was used to form electrically stable bonds at the interfaces between the electrodes and CNTs. Resistance measurements showed that the contact resistances of the CNTs on gold/iron and palladium were significantly improved by nickel embedding, whereas no further improvement was found for the CNTs on cobalt. Electroless metal deposition is a parallel process providing stable electrical and mechanical contacts between CNTs and metallic microelectrodes.

Copyright information

© Springer-Verlag 2003