Wood Science and Technology

, Volume 37, Issue 5, pp 339–348

Modification of wood with silicon compounds. inorganic silicon compounds and sol-gel systems: a review

Authors

    • Institute of Wood Biology and TechnologyUniversity of Göttingen
  • Holger Militz
    • Institute of Wood Biology and TechnologyUniversity of Göttingen
Original

DOI: 10.1007/s00226-003-0205-5

Cite this article as:
Mai, C. & Militz, H. Wood Sci Technol (2004) 37: 339. doi:10.1007/s00226-003-0205-5

Abstract

This review describes the treatment of wood with various inorganic silicon compounds. Among these compounds silicofluorides represent one of the long-known classes of wood preservatives based on silicon. Data on an organic fluorosilicon compound (“silafluofen”) are additionally presented. The mode of action of these fluorides is based on their biocidal action. “Water glass”, an alkali silicate, was able to enhance the durability of wood but showed some important drawbacks. Because of its high hygroscopicity and its high pH values, increased moisture absorption and strength loss of wood was frequently observed. Wood treated with tetraalkoxysilanes showed an enhanced dimensional stability, especially when the hydrolysis and the condensation of the silanes was controlled to react within the cell wall. Durability and fire resistance were improved to a certain degree and could be significantly enhanced by addition of boron compounds.

Abbreviations

ASE

antishrink efficiency

CCA

(preservatives based on) copper, chromium, arsenic

CSAS

colloidal silicic acid solution

EDX

energy dispersive X-ray analysis

EPMA

electron probe X-ray microanalysis

HFOETMOS

2-heptadecafluorooctylethyltrimethoxysilane

MEE

moisture-excluding efficiency

MoE

modulus of elasticity

r.h.

relative humidity

SAMS

silicic acid monomer solution

SEM

scanning electron microscopy

TEOS

tetraethoxysilane/triethyl orthosilicate

TEP

triethylphosphite

TGA

thermogravimetric analysis

TMB

trimethylborate

TMOS

tetramethoxysilane

TMP

trimethylphosphite

TPOS

tetrapropoxysilane

WPG

weight percent gain

Copyright information

© Springer-Verlag 2004