Date: 24 Nov 2012

The optimum projection angle of fringe projection for ball grid array inspection based on reflectance analysis

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A solder bump is regarded as a specular-dominant shiny component that distorts the height profile and causes poor repeatability during the bump height measurement. In this paper, we analyze the relationship between the projection angle and other factors based on the general reflectance mechanism of the specular surface. An optimum projection angle exists, such that can produce the best repeatability of the bump height measurement; therefore, we propose a convenient experimental system with a circular motion guide that can evaluate the optimum projection angle experimentally. The experimental results show that best repeatability is obtained with the optimum projection angle. The proposed method to find the optimum projection angle in this paper can therefore be applied to the many cases of measurement for ball grid array samples having specular-dominant shiny component.