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Metal-matrix composites for electronic packaging

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An Erratum to this article was published on 01 November 1992

Abstract

A materials revolution is underway, and there are profound implications for electronic packaging materials. Composites, especially metal-matrix composites, are playing a key role, because of their unique and tailorable combinations of properties; light weight; and low-cost, net-shape fabrication potential.

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References

  1. C. Zweben and K.A. Schmidt, “Advanced Composite Packaging Materials,” Packaging, vol. 1 of Electronic Materials Handbook (Materials Park, OH: ASM, 1989).

    Google Scholar 

  2. C. Zweben, “Advanced Composites—A Revolution for the Designer” (Paper presented at AIAA 50th Anniversary Annual Meeting and Technical Display, Learn from the Masters Lecture Series, Long Beach, CA, May 1981).

    Google Scholar 

  3. C. Zweben, “Metal Matrix Composites History, Overview and Applications,” Metal Matrix Composite Information Analysis Center Bulletin, 1(1) (1981).

  4. C. Zweben, Metal Matrix Composites Overview (Santa Barbara, CA: Metal Matrix Composite Information Analysis Center, 1984).

    Google Scholar 

  5. T.-W. Chou, A. Kelly, and A. Okura, “Fiber-Reinforced Metal-Matrix Composites,” Composites, 16 (1985), p. 187.

    CAS  Google Scholar 

  6. K.M. Prewo, “Fiber Reinforced Metal and Glass Matrix Composites,” Frontiers in Materials Technologies, ed. M.A. Meyers and O.T. Inal (Amsterdam, Netherlands: Elsevier, 1985).

    Google Scholar 

  7. U.S.Congress, Office of Technology Assessment, Advanced Materials by Design, report no. OTA-E-351 (Washington, D.C., June 1988).

  8. M. Schwartz, ed., Composite Materials Handbook, 2nd ed. (New York, NY: McGraw-Hill, 1992).

    Google Scholar 

  9. W.H. Hunt, Jr., C.R. Cook, and R.R. Sawtell, “Cost-Effective High Performance P/M Aluminum Matrix Composites for Automotive Applications” (Paper presented at the SAE International Congress and Exposition, Detroit, MI, 25 February–1 March 1991).

    Book  Google Scholar 

  10. W.H. Hunt, Jr., “Cost-Effective High Performance P/M Aluminum Matrix Composites for Aerospace Applications” (Paper presented at the International Conference on PM Aerospace Materials, Lausanne, Switzerland, 4–6 November 1991).

    Book  Google Scholar 

  11. Composites, vol. 1 of Engineered Material Handbook (Materials Parks, OH: ASM International, 1987).

  12. K.A. Schmidt and C. Zweben, “Mechanical and Thermal Properties of Silicon Carbide Particle—Reinforced Aluminum,” Thermal and Mechanical Behavior of Metal Matrix and Ceramic Matrix Composites, ed. L.M. Kennedy, H.H. Moeller, and W.S. Johnson (Philadelphia, PA: ASTM, 1989).

    Google Scholar 

  13. C. Thaw et al., “Metal Matrix Composite Microwave Packaging Components,” SAMPE Journal, 23(6) (1987), pp. 40–43.

    CAS  Google Scholar 

  14. “Breakthrough in Microwave Packaging Material,” Materials and Processing Report (January 1987), p. 5.

  15. W.A. Endicott, “Metal-Matrix Composite Shows Packaging Promise,” EDN, (November 17, 1988), p. 1.

    Google Scholar 

  16. D. White et al., “New High Ground in Hybrid Packaging,” Hybrid Circuit Technology (December 1990).

    Google Scholar 

  17. J. Browne, “GaAs FET AMP Launches 16W for Space Station,” Microwaves and RF (February 1991), p. 114.

    Google Scholar 

  18. A.L. Geiger and M. Jackson, “Electronic Applications of Discontinuously Reinforced Aluminum Matrix Composites” (Paper presented at the SAMPE Third Annual Electronic Materials and Processes Conference, 20–22 June 1989).

    Google Scholar 

  19. K. Kuniya et al., “Development of Copper-Carbon Fiber Composite for Electrodes of Power Semiconductor Devices,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 6(4) (1983).

  20. D.A. Foster, “Electronic Thermal Management Using CopperCoated Graphite Fibers,” SAMPE Quarterly (October 1989), pp. 58–64.

  21. S. Kennerknecht, “MMC Studies Via the Investment Casting Process,” Fabrication of Particulates Reinforced Metal Composites.

  22. X. Dumant, S. Kennerknecht, and R. Tombari, “Investment Cast Metal Matrix Composites,” SME paper EM90-441 (1990).

    Google Scholar 

  23. D.C. Packard, “Kevlar® Epoxy Substrate for Interconnecting Leadless Chip Carrier,” SAMPE Journal (January/ February 1984).

  24. Brush Wellman product data.

  25. J.P. Heremans et al., “The Low Temperature Thermal Conductivity of Carbon Fibers,” Proceedings of the 19th International Thermal Conductivity Conference (New York, NY: Plenum Press, 1985).

    Google Scholar 

  26. R.E. Taylor, “Things My Mother Never Taught Me, (About Thermophysical Properties of Solids),” Thermal Conductivity 21, ed. C.J. Cremens and H.A. Fine (New York, NY: Plenum Press, 1990), pp. 41–49.

    Google Scholar 

  27. B. Nysten, L. Piraux, and J-P. Issi, “Use of Thermal Conductivity Measurements to Characterize Carbon Fibers,” Proceedings of the 19th International Thermal Conductivity Conference (New York, NY: Plenum Press, 1985).

    Google Scholar 

  28. B. Nysten and J-P. Issi, “Composites Based on Thermally Hyperconductive Carbon Fibres,” Composites, 21(4) (1990), pp. 339–343.

    CAS  Google Scholar 

  29. C. Zweben, “Thermomechanical Properties of Fibrous Composite Materials: Theory,” Encyclopedia of Materials Scienceand Engineering, ed. M.B. Bever (Oxford: Pergamon Press, 1986).

    Google Scholar 

  30. Xavier Dumant, “Investment Cast Metal Matrix Composites for Microelectronics Packaging,” Cercast Group product brochure (May 3, 1991).

    Google Scholar 

  31. T. Donomoto et al., “Ceramic Fiber-Reinforced Piston for High Performance Diesel Engines,” SAE technical paper no. 830252 (1983).

    Book  Google Scholar 

  32. J.A. Vaccari, “Cast Aluminum MMCs Have Arrived,” American Machinist (June 1991), pp. 42–46.

  33. T. Hayashi, H. Ushio, and M. Ebisawa, “The Properties of Hybrid Fiber Reinforced Metal and Its Application for Engine Block” (Presented at the SAE International Congress and Exposition, 27 February–3 March 1989).

    Book  Google Scholar 

  34. M. Ebisawa et al., “Production Process of Metal Matrix Composite (MMC) Engine Block” (Presented at the SAE International Congress and Exposition, Detroit, MI, 25 February–1 March 1991).

    Book  Google Scholar 

  35. M.G. Bader et al., “The Fabrication and Properties of Metal-Matrix Composites Based on Aluminum Alloy Infiltrated Alumina Fibre Preforms,” Campos. Sci. Technol., 23 (1985), pp. 287–301.

    Google Scholar 

  36. J.A. Cornie et al., “Processing of Metal and Ceramic Matrix Composites,” Ceram. Bull., 65 (1986), p. 293.

    CAS  Google Scholar 

  37. A.J. Cook and P.S. Wemer, “Pressure Infiltration Casting of Metal Matrix Composites,” Materials Science and Engineering, A144 (1991), pp. 186–206.

    Google Scholar 

  38. M.K. Premkumar, D.I. Yun, and R.R. Sawtell, “Aluminum Composite Materials via Pressure Casting” (Paper presented at the 1992 TMS Annual Meeting, San Diego, CA, 25 March 1992).

    Google Scholar 

  39. T.R. Anthony et al., “Thermal Diffusivity of Isotopically Enriched 12C Diamond,” Physical Review B, 42 (1990), pp. 1104–1111.

    CAS  Google Scholar 

  40. R.S. Clough et al., “Preparation and Properties of Reflowed Paste and Bulk Composite Solder,” NEPCON West ’92 (Des Plaines, IL: Cahners Exposition Group, 1992), pp. 1256–1265.

    Google Scholar 

  41. S.M.L. Sastry et al., “Microstructures and Mechanical Properties of In-Situ Composite Solders,” NEPCON West ’92 (Des Plaines, IL: Cahners Exposition Group, 1992), pp. 1266–1275.

    Google Scholar 

  42. M. Zhu and D.D.L. Chung, “Carbon Fiber Silver-Copper Laminates as a Composite Brazing Material for Metal-Ceramic Joining” (Paper presented at the Conference on Materials for Electronic Packaging, State University at Buffalo, Buffalo, NY, August 1991).

    Google Scholar 

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Authors and Affiliations

  1. General Electric’s Astro Space Division, King of Prussia, Pennsylvania, USA

    Carl Zweben Ph.D. (advanced technology manager and division fellow, member of TMS)

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  1. Carl Zweben Ph.D.
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Additional information

An erratum to this article is available at http://dx.doi.org/10.1007/BF03222850.

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Zweben, C. Metal-matrix composites for electronic packaging. JOM 44, 15–23 (1992). https://doi.org/10.1007/BF03222270

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