Optical interferometry for surface measurements of CMP pads
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Optical interferometry was used to quantitatively characterize the surface of chemical-mechanical polishing (CMP) pads used to polish oxide films. We discuss the optical interferometry technique, including a description of the parameters necessary to compare pad samples. Flat, mesa-like structures formed on the pad during the first 5 min polish when conditioning was not used. The data from the optical interferometer indicated that the surface topography did not change with subsequent polishing, even though the thermal oxide removal rate continued to decrease. We found conditioning roughened the pad surface. Rougher pad surfaces removed more oxide during a single 5 min polish than comparatively smooth pad surfaces. Data indicates that conditioning increases and stabilizes pad surface roughness.
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- Optical interferometry for surface measurements of CMP pads
Journal of Electronic Materials
Volume 25, Issue 10 , pp 1623-1627
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- Chemical-mechanical polishing
- Optical interferometry
- Oxide films
- Surface morphology
- Industry Sectors
- Author Affiliations
- 1. Department of Chemical and Nuclear Engineering, University of New Mexico, 87131, Albuquerque, NM
- 2. Sandia National Laboratories, P.O. Box 5800, 87123, Albuquerque, NM
- 3. WYK0 Corporation, 2650 East Elvira Road, 85706, Tucson, AZ