Journal of Electronic Materials

, Volume 25, Issue 10, pp 1623–1627

Optical interferometry for surface measurements of CMP pads


  • David Stein
    • Department of Chemical and Nuclear EngineeringUniversity of New Mexico
  • Dale Hetherington
    • Sandia National Laboratories
  • Mike Dugger
    • WYK0 Corporation
  • Tom Stout
    • WYK0 Corporation

DOI: 10.1007/BF02655586

Cite this article as:
Stein, D., Hetherington, D., Dugger, M. et al. JEM (1996) 25: 1623. doi:10.1007/BF02655586


Optical interferometry was used to quantitatively characterize the surface of chemical-mechanical polishing (CMP) pads used to polish oxide films. We discuss the optical interferometry technique, including a description of the parameters necessary to compare pad samples. Flat, mesa-like structures formed on the pad during the first 5 min polish when conditioning was not used. The data from the optical interferometer indicated that the surface topography did not change with subsequent polishing, even though the thermal oxide removal rate continued to decrease. We found conditioning roughened the pad surface. Rougher pad surfaces removed more oxide during a single 5 min polish than comparatively smooth pad surfaces. Data indicates that conditioning increases and stabilizes pad surface roughness.

Key words

Chemical-mechanical polishingOptical interferometryOxide filmsSurface morphology

Copyright information

© The Metallurgical of Society of AIME 1996