The Effect of Rapid Solidification Velocity on the Microstructure of Ag-Cu Alloys
- Cite this article as:
- Boettinger, W.J., Shechtman, D., Schaefer, R.J. et al. MTA (1984) 15: 55. doi:10.1007/BF02644387
- 861 Downloads
Electron beam solidification passes have been performed on a series of Ag-Cu alloys between 1 wt pct Cu and the eutectic composition (28.1 wt pct Cu) at speeds between 1.5 and 400 cm per second. At low growth rates conventional dendritic or eutectic structures are obtained. The maximum growth rate of eutectic structure is 2.5 cm per second. At high growth rates microsegregation-free single phase structures are obtained for all compositions. The velocity required to produce this structure increases with composition for dilute alloys and agrees with the theory of absolute stability of a planar liquid-solid interface with equilibrium partitioning. For alloys between 15 and 28 wt pct Cu, the velocity required to produce the microsegregation-free extended solid solution decreases with composition and is related to nonequilibrium trapping of solute at the liquid solid interface. At intermediate growth rates for alloys with 9 wt pct Cu or greater, a structure consisting of alternating bands of cellular and cell-free material is obtained. The bands form approximately parallel to the local interface.