Applied Physics A

, Volume 63, Issue 2, pp 117–121

Picosecond laser ablation of thin copper films

  • J. Jandeleit
  • G. Urbasch
  • H. D. Hoffmann
  • H. -G. Treusch
  • E. W. Kreutz
Regular Papers

DOI: 10.1007/BF01567638

Cite this article as:
Jandeleit, J., Urbasch, G., Hoffmann, H.D. et al. Appl. Phys. A (1996) 63: 117. doi:10.1007/BF01567638

Abstract

The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated toFthres = 172 mJ/cm2. The ablation rate per pulse is measured as a function of intensity in the range of 5 × 109 to 2 × 1011 W/cm2 and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.

PACS

81.60.B79.20D

Copyright information

© Springer-Verlag 1996

Authors and Affiliations

  • J. Jandeleit
    • 1
  • G. Urbasch
    • 1
  • H. D. Hoffmann
    • 1
  • H. -G. Treusch
    • 2
  • E. W. Kreutz
    • 1
  1. 1.Lehrstuhl für LasertechnikRWTH AachenAachenGermany
  2. 2.Fraunhofer-Institut für LasertechnikAachenGermany