Applied Physics B

, Volume 42, Issue 1, pp 41–43

Laser ablation of polymers in pressurized gas ambients

  • G. Koren
  • U. P. Oppenheim
Contributed Papers

DOI: 10.1007/BF00694772

Cite this article as:
Koren, G. & Oppenheim, U.P. Appl. Phys. B (1987) 42: 41. doi:10.1007/BF00694772

Abstract

Excimer-laser ablation of polyimide films into He and N2 atmospheres in the pressure range of 5×10−5–10−2 atm is reported. Using 193 nm radiation at 1 J/cm2, it was found that the etch depth per pulse decreases by a factor of 2 with increasing ambient pressure. A description of the ablation process is presented in terms of a strong point explosion model with an outgoing shock wave which produces ingoing drag forces in the gas near the film. These drag a fraction of the ablated fragments and partially redeposit them onto the sample, thus reducing the observed etch depth per pulse.

PACS

81.60JW47.40KI82.65NZ

Copyright information

© Springer-Verlag 1987

Authors and Affiliations

  • G. Koren
    • 1
  • U. P. Oppenheim
    • 1
  1. 1.Department of PhysicsTechnion-Israel Institute of TechnologyHaifaIsrael