Journal of Materials Science

, Volume 30, Issue 21, pp 5551–5553

Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate

  • T. Maruyama
  • T. Shirai

DOI: 10.1007/BF00351572

Cite this article as:
Maruyama, T. & Shirai, T. JOURNAL OF MATERIALS SCIENCE (1995) 30: 5551. doi:10.1007/BF00351572


Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (II) acetylacetonate. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was close to that for bulk copper.

Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • T. Maruyama
    • 1
  • T. Shirai
    • 1
  1. 1.Department of Chemical Engineering, Faculty of EngineeringKyoto UniversityKyotoJapan

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