Maruyama, T. & Shirai, T. JOURNAL OF MATERIALS SCIENCE (1995) 30: 5551. doi:10.1007/BF00351572
Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (II) acetylacetonate. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was close to that for bulk copper.