Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate Papers Received: 24 March 1994 Accepted: 11 May 1995 DOI:
Cite this article as: Maruyama, T. & Shirai, T. JOURNAL OF MATERIALS SCIENCE (1995) 30: 5551. doi:10.1007/BF00351572 Abstract
Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (II) acetylacetonate. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was close to that for bulk copper.
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