, Volume 30, Issue 21, pp 5551-5553

Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate

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Abstract

Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (II) acetylacetonate. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was close to that for bulk copper.