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Thermal stability of Mo/Si multilayer soft-X-ray mirrors fabricated by electron-beam evaporation

  • Surfaces And Multilayers
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Abstract

Mo/Si multilayers are fabricated by electron-beam evaporation in UHV at different temperatures (30° C, 150° C, 200° C) during deposition. After completion their thermal stability is tested by baking them at temperatures (T bak) between 200° C and 800° C in steps of 50° C or 100° C. After each baking step the multilayers are characterized by small angle Cu-X-ray diffraction. Additionally, the normal incidence soft-X-ray reflectivity for wavelengths between 11 nm and 19 nm is determined after baking at 500° C. Furthermore, the layer structure of the multilayers is investigated by means of Rutherford Backscattering Spectroscopy (RBS) and sputter/Auger Electron Spectroscopy (AES) technique. While the reflectivity turns out to be highest for a deposition temperature of 150° C, the thermal stability of the multilayer increases with deposition temperature. The multilayer deposited at 200° C stands even a 20 min 500° C baking without considerable changes in the reflectivity behaviour.

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Stock, H.J., Kleineberg, U., Heidemann, B. et al. Thermal stability of Mo/Si multilayer soft-X-ray mirrors fabricated by electron-beam evaporation. Appl. Phys. A 58, 371–376 (1994). https://doi.org/10.1007/BF00323612

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  • DOI: https://doi.org/10.1007/BF00323612

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