, Volume 25, Issue 5, pp 559-565

Synthesis of high purity o-cresol formaldehyde novolac epoxy resins

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The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress test condition.