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Nanoscratch Behavior of Dendrimer-Mediated Ti Thin Films

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Ramped load nanoscratch behaviors of titanium thin films with and without dendrimer mediation were extensively studied. By combining in situ investigation of scratch surface profiles and coefficients of friction curves, with ex situ microscopic (OM, AFM) and spectroscopic (AES) examinations of scratch tracks, different scratch failure modes were identified. An adhesive failure was found in the dendrimer-mediated films, whereas a cohesive failure was in the dendrimer-free samples.

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Authors and Affiliations

  1. Center for Materials for Information Technology, The University of Alabama, Tuscaloosa, AL, 35487-0209, USA

    X. Li, F. Huang, S.C. Street & M.L. Weaver

  2. Department of Chemistry, The University of Alabama, Tuscaloosa, AL, 35487-0336, USA

    M. Curry & S.C. Street

  3. Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL, 35487-0202, USA

    X. Li & M.L. Weaver

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  1. X. Li
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  2. F. Huang
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  3. M. Curry
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  4. S.C. Street
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  5. M.L. Weaver
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Correspondence to M.L. Weaver.

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Li, X., Huang, F., Curry, M. et al. Nanoscratch Behavior of Dendrimer-Mediated Ti Thin Films. Tribol Lett 19, 273–280 (2005). https://doi.org/10.1007/s11249-005-7444-6

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  • DOI: https://doi.org/10.1007/s11249-005-7444-6

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