Materials & Process Integration for MEMS

1. Front Matter

   Pages N3-xix

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2. Integration of Piezoelectric Pb(ZrxTi1-x)O3 (PZT) Thin Films into Micromachined Sensors and Actuators

   • Paul Muralt, Nicolas Ledermann, Jacek J. Baborowski, Sandrine Gentil

   Pages 1-24

3. Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding

   • A. Prochaska, S. J. N. Mitchell, H. S. Gamble

   Pages 25-50

4. GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs

   • T. Lalinsky, M. Drzik, L. Matay, I. Kostic, Z. Mozolova, S. Hascik et al.

   Pages 51-75

5. Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications

   • Yongqing Fu, Hejun Du

   Pages 77-96

6. Chemically Amplified Resist for Micromachining Using X-Ray Lithography

   • T. L. Tan, V. A. Kudryashov, B. L. Tan

   Pages 97-111

7. Self-Assembled Monolayers (SAM) for Tunneling Sensors

   • Francis E. H. Tay, S. J. O’Shea, Andrew T. S. Wee, Poh Chong Lim, Andojo Ongkodjojo

   Pages 113-132

8. Oxidation Process-Optimization for Large Area Silicon Fusion Bonded Devices and MEMS Structures

   • K. N. Bhat, N. DasGupta, A. DasGupta, P. R. S. Rao, R. Navin Kumar, Y. Chandana

   Pages 133-156

9. Silicon Nanomachining by Scanning Probe Lithography and Anisotropic Wet Etching

   • J. T. Sheu, H. T. Chou, W. L. Cheng, C. H. Wu, L. S. Yeou

   Pages 157-174

10. A Novel Bulk Micromachining Method in Gallium Arsenide

    • Dong-il Dan Cho, Jongpal Kim, Setae Kim, Sangjun Park, Seung-Joon Paik, Chiwan Ku et al.

    Pages 175-184

11. Deep X-ray Lithography for MEMS — Photoelectron Exposure of the Upper and Bottom Resist Layers

    • Vladimir Kudryashov, Paul Lee

    Pages 185-202

12. Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnect

    • Arief Budiman Suriadi, Vineet Sharma, Bernhard Wieder, Gerald Mittendorfer

    Pages 203-229

13. Uncooled Infrared Image Sensor of Dielectric Bolometer Mode Using Ferroelectric BST Thin Film Prepared by Metal Organic Decomposition

    • Hong Zhu, Jianmin Miao, Minoru Noda, Huaping Xu, Masanori Okuyama

    Pages 231-256

14. Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process

    • Dong-il Dan Cho, Sangjun Park, Jongpal Kim, Sangchul Lee, Sang Woo Lee

    Pages 257-272

15. Plasma Etching Techniques to Form High-Aspect-Ratio MEMS Structures

    • Won Jong Yoo, Kitt Wai Kok, Say Yong Koh

    Pages 273-294

16. Back Matter

    Pages 295-299

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The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high­ volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.

• X-ray
• alloy
• metals
• polymer
• polymers

• The National University of Singapore, Singapore

  Francis E. H. Tay

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