Abstract
The effect of the state of stress at a film-substrate interface on the elastic deformation of Ti films is studied during alternating bending. The Al substrate compliance is shown to cause coherent deformation of the film-substrate system, resulting in the corrugation of a Ti film and the appearance of a wavelike film-substrate interface. Fatigue tests lead to the formation of a periodic distribution of normal and tangential stresses along the interface, and this distribution favors periodic film corrugation. The corrugation of a Ti film on a Ti substrate occurs randomly in local film separation areas and is caused by defects accumulated at the interface.
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Original Russian Text ©A.R. Shugurov, A.V. Panin, M.S. Kazachenok, 2010, published in Zhurnal Tekhnicheskoĭ Fiziki, 2010, Vol. 80, No. 11, pp. 35–40.
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Shugurov, A.R., Panin, A.V. & Kazachenok, M.S. Elastic deformation of Ti films during alternating bending. Tech. Phys. 55, 1583–1587 (2010). https://doi.org/10.1134/S106378421011006X
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DOI: https://doi.org/10.1134/S106378421011006X