Skip to main content
SpringerLink
Log in

Heat-Conductive Adhesives — Cool Solutions for Versatile Applications

  • Applications
  • Optimized Thermal Management
  • Published:
adhesion ADHESIVES + SEALANTS Aims and scope

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Figure 1
Figure 2
Figure 3
Figure 4
Figure 5

References

  1. Brockmann, W.; Geiß, P.L.; Klingen, J.; Schröder, B.: Klebtechnik, Wiley-VCH Verlag 2005

    Book  Google Scholar 

  2. Habenicht, G.: Bonding: Grundlagen, Technologie, Anwendungen, Springer Verlag 2006

    Google Scholar 

  3. Mezger, T.: Angewandte Rheologie, Anton Paar GmbH 2014

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Panacol-Elosol GmbH, Steinbach/Taunus, Deutschland

    Heiko Fauser (works as developer at Panacol-Elosol GmbH in Steinbach/Taunus)

Authors
  1. Heiko Fauser
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Heiko Fauser.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Fauser, H. Heat-Conductive Adhesives — Cool Solutions for Versatile Applications. Adhes Adhes Sealants 15, 18–23 (2018). https://doi.org/10.1007/s35784-018-0017-5

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s35784-018-0017-5

Keywords

Search

Navigation