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Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application

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Abstract

Thermo-setting type anisotropically conductive adhesives have been identified to possess key properties suitable for interconnection of bare chip directly to glass substrate (CoG). The coG technology offers higher electric performance, shorter signal delays and further miniaturisation compared to the conventional heat seal interconnecting technology.

This paper summarizes reliability testing results using thermo-setting anisotropically conductive for CoG interconnection. Anisotropically conductive adhesives in paste and film are used for interconnection on the following bumping surfaces: chemical plated Ni and electrolytically plated Au.

Mechanical and electric measurements were performed before and after environmental tests in terms of temperature cycling between −40 and +85°C for 1000 cycles and in terms of different constant humidity conditions at 60°C, 95% RH and at 85°C, 85% RH, each for 1000 hours. The results show that high-reliable anisotropically conductive adhesive joints can be obtained for the CoG application.

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This work is sponsored by NUTEK (the National Swedish Board for Industrial and Technical Development) with Grant No 92-9258 and supported by the following companies: DA Elektronik AB, Ericsson Components AB, Ericsson Microwave Systems AB, Esselte Meto Electronic Display Systems, ICL AB, Loctite Ltd, Nokia Mobile Phones OY, Planar International Ltd, Propoint Electronics AB, Combitech Electronics AB, Touch Display Systems AB and Victor Hasselblab AB.

This work is also a result of a collaboration between VTT Electronics Laboratory, Finland and IVF, Sweden.

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Liu, J., Ljungkrona, L. Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application. Microsystem Technologies 2, 32–37 (1995). https://doi.org/10.1007/BF02739526

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  • DOI: https://doi.org/10.1007/BF02739526

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