Skip to main content
Log in

Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. N.C. Lee, Solder. Surf. Mount Technol. 9, 65 (1997)

    CAS  Google Scholar 

  2. M. Abtew, G. Selvaduray, Chip Scale Rev. 2, 29 (1998)

    Google Scholar 

  3. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, Lead-Free Soldering-An Analysis of the Current Status of Lead-Free Soldering, (UK Dept. of Trade & Industry Report, 1999) p. 1

  4. K. Suganuma, Curr. Opin. Solid. State Mater. Sci. 5, 55 (2001)

    Article  CAS  Google Scholar 

  5. K.N. Tu, A.M. Gusak, M. Li, J. Appl. Phys. 93, 1335 (2003)

    Article  CAS  Google Scholar 

  6. A. Hirose, H. Yanagawa, E. Ide, K.F. Kobayashi, Sci. Technol. Adv. Mater. 5, 267 (2004)

    Article  CAS  Google Scholar 

  7. H. John, L. Pang, B.S. Xiong, T.H. Low, Creep and Fatigue Characterization of Lead Free 95.5Sn-3.8Ag-0.7Cu Solder, Electronic Components and Technology Conference, (2004), p. 1333

  8. C.M.L. Wu, M.L.L. Huang, IEEE Trans. Adv. Packag. 28, 128 (2005)

    Article  CAS  Google Scholar 

  9. Zs. Illyefalvi-Vitez, J. Pinkola, G. Harsanyi, Cs. Dominkovics, B. Illes, L. Tersztyanszky, Present Status of Transition to Pb-Free Soldering, Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar, 19–20, 88 May 2005

  10. U.R. Kattner, W.J. Boettinger, J. Electron. Mater. 23, 603 (1994)

    CAS  Google Scholar 

  11. X.P. Zhang, H.W. Wang, Y.W. Shi, J. Mater. Sci. - Mater. Electron. 15, 511 (2004)

    Article  CAS  Google Scholar 

  12. A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, G. Mitic, Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders, Proceedings of International Symposium and Exhibition on Advanced Packaging Materials, Braselton, Georgia, USA, 11–14 March 2001, p. 129

  13. R. Darveaux, K. Banerji, A. Mawer, G. Dody In: J.H. Lau (ed.), (Ball Grid Array Technology, McGraw-Hill, Newyork, 1995), p. 379

  14. J. Cadek Material Science Monographs, (Elsevier, Amsterdam, 1988)

    Google Scholar 

  15. S. Wiese, A. Schubert, H. Walter, R. Dudek, F. Feustel, E. Meusel, B.Michel, Constitutive behavior of lead-free solders vs lead-containing solders-Experiments on bulk specimens and flip-chip joints, Proceedings of 51st Electronic Components and Technology Conference, Orlando, Florida, p. 890 (2001)

  16. Q. Xiao, L. Nguyen, W.D. Armstrong, Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy, Proceedings of 54th Electronic Components and Technology Conference, (Las Vegas, Nevada, USA, 1–4 June 2004 vol.2), p. 1325

  17. T.E. Homa, Cracking of electronic packaging joints due to creep-fatigue, Proceedings of ASM’s 3rd Conference on Electronic Packaging and Corrosion in Microelectronics, (Minneapolis, Minnesota, 28–30 April 1987), p. 9

Download references

Acknowledgements

This research is supported by the Ministry of Education, China, through a program of NCET (04–0824) and the matching grant, and the Natural Science Foundation of China under grants No.50471038 and 50671037.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to X. P. Zhang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhang, X.P., Yu, C.B., Shrestha, S. et al. Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures. J Mater Sci: Mater Electron 18, 665–670 (2007). https://doi.org/10.1007/s10854-006-9078-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-006-9078-3

Keywords

Navigation