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The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation

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Abstract

The precipitation, dissolution, and reprecipitation processes of Al2Cu (θ phase) in Al-2 wt pct Cu thin films were studied. The films were characterized in the as-deposited condition, after annealing at 425 °C for 35 minutes, and after rapid thermal annealing (RTA) at 345 °C, 405 °C, and 472 °C. In the as-deposited samples, the precipitates had a fine even distribution throughout the thin film both at aluminum grain boundaries and within the aluminum grains. Annealing below the solvus temperature caused the grain boundary precipitates to grow and precipitates within the center of aluminum grains to diminish. Annealing above 425 °C caused the θ-phase precipitates to dissolve. Upon cooldown, the θ phase nucleated at aluminum grain boundaries and triple points in the form of plates.In situ heating and cooling experiments documented this process in real time. Analytical microscopy revealed that there is a depletion of copper at the aluminum grain boundaries in regions free of precipitates. The θ-phase precipitates nucleated and grew at the grain boundariesvia a collector plate mechanism and drew copper from the areas adjacent to the aluminum grain boundaries.

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Authors and Affiliations

  1. Sandia National Laboratories, 87185, Albuquerque, NM

    A. D. Romig (Senior Member of Technical Staff)

  2. Lawrence Berkeley Laboratory, 94720, Berkeley, CA

    J. E. Sanchez & J. W. Morris

Authors
  1. D. R. Frear
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  2. J. E. Sanchez
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  3. A. D. Romig
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  4. J. W. Morris
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Additional information

This paper is based on a presentation made in the symposium “Interface Science and Engineering” presented during the 1988 World Materials Congress and the TMS Fall Meeting, Chicago, IL, September 26–29, 1988, under the auspices of the ASM-MSD Surfaces and Interfaces Committee and the TMS Electronic Device Materials Committee.

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Frear, D.R., Sanchez, J.E., Romig, A.D. et al. The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation. Metall Trans A 21, 2449–2458 (1990). https://doi.org/10.1007/BF02646989

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